HCS8806 – Micro Bonder
The HCS8806 series “Micro Bonder” is a compact portable composite curing controller designed to accomplish localized repairs on composite structures or for use in other composite curing / training applications. This model has 6 thermocouple inputs.
- Operating Voltage: 120 or 240V, single phase
- Current (Amps) Maximum Load: 16 Amps
- Operating Environmental Limitations:
- Temperature: 0 – 115° F (-18° – 46.1° C)
- Relative Humidity: 0 – 99%
- Cure Temperature Range: 0 – 500° F (-18° – 260° C)
- Control Parameters:
- Internal Control System Resolution: 0.5° F (0.28° C)
- Display Resolution: 1.0° F (0.55° C)
- Program Resolution: 1.0° F (0.55° C)
- Temperature Accuracy: /- 1° F (0.55° C)
- Control Methods:
- Hottest TC
- TC Average
- Coolest TC
- Vacuum Monitoring Capability: 0 – 30 in/Hg
- Temperature Feedback: 6 Type J Thermocouples
- Operation Interface: 4 Push Buttons with Menu Selected/Real Language Screens on a Dark and Sunlight Readable 2.8 in. (71.1mm) Liquid Crystal Display (LCD)
- Power Failure/Recovery: Power Recovery within 2 minutes of power loss results in continued program operation
- Alarm Volume: 77 dB (Adjustable)
- Programs Stored to Memory: 8 Separate programs – either downloaded via USB, or operator-entered
- Cure Data Download: USB Uploadable to HEATCON® Composite Systems DCAS Software
- Dimensions and Weight Control Unit:
- 10 in. x 6.5 in. x 2.5 in. (254mm x 165.1mm x 63.5mm)
- 4.1 lbs (1.9kg)